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PCB substrate material industry development stage



PCB substrate material industry development stage

Early 20th century to the late 1940s, is the embryonic stage of the development of PCB substrate materials industry.

Its development features mainly in this period: substrate materials used in a large number of resin, reinforced materials and insulating substrate emerge, the technology has been a preliminary exploration. These are the most typical printed circuit board material - the advent of CCL and development, and created the necessary conditions.

On the other hand, the PCB manufacturing technology, which is mainly made by the circuit of metal foil etching (subtraction method), has been initially established and developed. It is CCL in the structural composition, the determination of the characteristics and conditions, played a decisive role.